Laser Scribe Silicon Wafer Solar Cell Laser Cutting Machine

Product Details
Customization: Available
Production Scope: Product Line
Condition: New
Manufacturer/Factory
Gold Member Since 2022

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Registered Capital
5000000 RMB
Plant Area
501~1000 square meters
  • Laser Scribe Silicon Wafer Solar Cell Laser Cutting Machine
  • Laser Scribe Silicon Wafer Solar Cell Laser Cutting Machine
  • Laser Scribe Silicon Wafer Solar Cell Laser Cutting Machine
  • Laser Scribe Silicon Wafer Solar Cell Laser Cutting Machine
  • Laser Scribe Silicon Wafer Solar Cell Laser Cutting Machine
  • Laser Scribe Silicon Wafer Solar Cell Laser Cutting Machine
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Basic Info.

Model NO.
OLS-20F
After-sales Service
on-Line Support
Laser Wavelength
1064nm
Laser Power
20W
Scribing Width
30μm
Scribing Speed
300mm/S
Warranty
One Year Warranty
Transmission Type
Flexible
Automatic Production Line
Assembly
Certification
CE
Flexible Production
Intelligent Manufacturing
Rhythm
Flow Production Line
Transport Package
Air or Sea Transportation
Trademark
Ooitech
Origin
China
Production Capacity
50/Per Year

Product Description

[ Machine Function ]
scribing or cutting the Solar Cells and Silicon Wafers in solar PV industry, including the mono-si (mono crystalline silicon) and poly-si (poly crystalline silicon)solar cells and silicon wafer. 
Laser Scribe Silicon Wafer Solar Cell Laser Cutting Machine
Top 10 Advantages of Solar Cell Non-Destructive Laser Scribing Machine:

Top 1: WaterlessNo Secondary Pollution
Top 2: Low TemperatureHigh Performance
Top 3: 156-230mmP & N type Compatible
Top 4: PERC HIT TOPCONHJT IBC Compatible
Top 5: CCD auto-correction
Top 6: Ultra-low broken rate, No hidden cracks
Top 7: Ultra-high bending strength
Top 8: High usage rate, Maintenance-free
Top 9: Can update to 1/31/4 1/5 upto 1/7
Top 10: CompatibleUnloading box


Function: 
solar cell non-destructive laser scribing machine is automatic non-constructive laser cutting machine that is used to scribe and break apart full solar cells to half-cutting cells, no mechanical splitting cell to get the best cutting effect. it is integrated with loading and unloading systems, laser scribing, automatic break-apart, and vision detection systems. This machine is widely used in PV industry to produce high-efficiency silicon solar modules in China and other countries.

Features of equipment
  1. The latest technology of Non-Destructive Cutting (thermal laser separation technology)
  2. Dry Cutting, Waterless, no need water spray during Splitting (No Water Stains Pollution)
  3. High throughput upto 7000pcs/h(SL5-UD7000)
  4. Low breakage rate, less than 0.05%
  5. Low Splitting Temperature (<130°C), meets the lower temperature requirement of PERC Hit Topcon IBC Cells cutting.
  6. N-type and P-type cells Compatible
  7. Smooth cutting surface with no cracks
  8. Easy to upgrade reserved space to upgrade to 1/3 1/4 cut
  9. Simple process, with only 4 steps: loading, Slotting, Splitting and unloding. Without water spraying and drying process
  10. Low breakage rate ≤0.05%
  11. Automatic split, no mechanical split action, split directly by laser
  12. Easy Maintenance
  13. Optional to butt-joint ATW or Lead tabber stringer, finished cut cells could transfer to stringer by update kits
  14. Visual detection systems, 20Mpixel CCD Industrial camera could pickup NG cells out and auto-correct the cutting position
  15. Less dust: micro-dust, only a few dust is generated clean and environmentally friendly

[ Machine Features ]
1. Using the China Top Brand Raycus Fiber laser 
  service time over 100,000hours. Stronger adaptability to environment
2. Work table: X-Y movable
  Solar cell can be automatic absorption 
3. Air cooling, compact structure, small size
4. Higher conversion efficency,
lower operating cost, save power consumption, cost and shorter maintenance time; 
5. Laser Pulse width is more narrow,
Higher peak power, faster scribing cutting speed
6.Long time uninterrupted continuous maintenance-free operation,
 no consumable wearing parts to replace
7. Stepper motor or servo motor different cost.
[ Technical Parameters ]
Model OLS-20F
Laser wavelength 1064nm
Laser power 20W
Scribing width 30μm
Scribing speed 300mm/s
Scribing accuracy ±10μm
Working area 245x245mm
Temperature control precision 0.5°C
Working power 220V/50Hz/1kvA
Working table negative pressure absorbing and dust elimination
Cooling method Forced air cooling

Pictures
 
 
Laser Scribe Silicon Wafer Solar Cell Laser Cutting Machine
Laser Scribe Silicon Wafer Solar Cell Laser Cutting Machine
Laser Scribe Silicon Wafer Solar Cell Laser Cutting Machine


 
Laser Scribe Silicon Wafer Solar Cell Laser Cutting Machine
Laser Scribe Silicon Wafer Solar Cell Laser Cutting Machine
Laser Scribe Silicon Wafer Solar Cell Laser Cutting Machine



Laser Scribe Silicon Wafer Solar Cell Laser Cutting Machine
Laser Scribe Silicon Wafer Solar Cell Laser Cutting MachineLaser Scribe Silicon Wafer Solar Cell Laser Cutting Machine

 

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