The Newest Solar Cell Laser Cutting Machine-Solar Panl Production Line

• After-sales Service: Excellent After-Sales Service
• Warranty: Lifetime
• Transport Package: Sea Freight
• Shipping Cost: Estimated freight per unit.: about shipping cost and estimated delivery time.
• Currency: US$
• Return&refunds: You can apply for a refund up to 30 days after receipt of the products.
• Model NO.: OLS-2000S; OLS-2000F
• Origin: China
• Production Capacity: 1000 Pieces/Year

Product Description

Machine Function

Suitable for scribing or cutting the Solar Cells and Silicon Wafers in solar PV industry, including the mono-si  and poly-si solar cells and silicon wafer. 
It can realize functions such as automatic material feeding, cell positioning, laser scribing, and boxing. Professional control software, free maintenance, easy operation.

Machine Features

1. Advanced scribing technology: 

Adopt fiber laser source, good quality laser beam, slim laser scribing line, more uniform solar cell cutting surface, small damage to solar cell, high accuracy cutting.

1. High efficiency: 

High laser scribing speed, producing capacity can reach to 1500 full cells/hour

1. Accuracy positioning:

Solar cell full automatic positioning, positioning accuracy ≤±0.1mm

1. High automation level: 

Solar cell automatic loading and unloading, automatic positioning, automatic scribing. Stable performance, low failure rate, easy maintenance.

Technical Parameters

Items	Parameters and configuration
Positioning accuracy	Cell automatic positioning, error range ≤±0.1 mm
Laser wavelength (nm)	1064
Maximum scribing speed	500 mm/s Adjustable
Actual output	1800 full cells/hour (calculated by single cut of 166mm cell without splitting) 1500 full cells/hour (calculated by single cut and auto splitting of 166mm cell)
Accuracy of scribing	±0.1mm
Line width	40μm
Work table area/trip	Maximum working area: 245×245 mm (2pcs) Module max running area :300×300 mm
Material size	156 x156~210 x210mm monocrystalline silicon, polycrystalline silicon solar cells and silicon wafers
Material thickness	0.18-0.30 mm
Cell thickness deviation	±10μm
Breakage rate	≤0.15%

Equipment configuration
 

Laser Source		Raycus 30 W Q-switched λ=1064 nm
Computer		Has storage function, reserved USB interface, with display, mouse, keyboard
Main Control Power Protection systems		Each motor load should be equipped with short circuit protection / circuit breaker, the equipment is equipped with grounding terminal, in accordance with the national equipment electrical safety regulations.
Vacuum adsorption		Bernoulli suction cup (No trace absorption, no damage to the material)
Worktable module	Driver	Servo Motor
	Ball-screw Module	Chinese brand (effective travel range 300 mm)
	Coupling	Chinese Brand
	Vacuum adsorption	Fan adsorption, automatic control of vacuum generation/breakdown
	Dust removal system	Dust removal fan
Professional software		Friendly working interface, simple and convenient programming, motion track display
Power supply		220V/50HZ/3kVA
Safety measures		Work area machinery, laser and other dangerous parts, affixed warning signs
Noise		Noise generated during normal working conditions complies with national norms
Other		Alarm warning

Pictures