The Newest Solar Cell Laser Cutting Machine-Solar Panl Production Line

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Registered Capital
5000000 RMB
Plant Area
501~1000 square meters
  • The Newest Solar Cell Laser Cutting Machine-Solar Panl Production Line
  • The Newest Solar Cell Laser Cutting Machine-Solar Panl Production Line
  • The Newest Solar Cell Laser Cutting Machine-Solar Panl Production Line
  • The Newest Solar Cell Laser Cutting Machine-Solar Panl Production Line
  • The Newest Solar Cell Laser Cutting Machine-Solar Panl Production Line
  • The Newest Solar Cell Laser Cutting Machine-Solar Panl Production Line
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Basic Info.

Model NO.
OLS-2000S; OLS-2000F
Origin
China
Production Capacity
1000 Pieces/Year

Product Description

The Newest Solar Cell Laser Cutting Machine-Solar Panl Production Line
Machine Function

Suitable for scribing or cutting the Solar Cells and Silicon Wafers in solar PV industry, including the mono-si  and poly-si solar cells and silicon wafer. 
It can realize functions such as automatic material feeding, cell positioning, laser scribing, and boxing. Professional control software, free maintenance, easy operation.

Machine Features
  1. Advanced scribing technology: 
Adopt fiber laser source, good quality laser beam, slim laser scribing line, more uniform solar cell cutting surface, small damage to solar cell, high accuracy cutting.
  1. High efficiency: 
High laser scribing speed, producing capacity can reach to 1500 full cells/hour
  1. Accuracy positioning:
Solar cell full automatic positioning, positioning accuracy ≤±0.1mm
  1. High automation level: 
Solar cell automatic loading and unloading, automatic positioning, automatic scribing. Stable performance, low failure rate, easy maintenance.

Technical Parameters
Items Parameters and configuration
Positioning accuracy Cell automatic positioning, error range ≤±0.1 mm
Laser wavelength (nm) 1064
Maximum scribing speed 500 mm/s Adjustable
Actual output 1800 full cells/hour (calculated by single cut of 166mm cell without splitting)
1500 full cells/hour (calculated by single cut and auto splitting of 166mm cell)
Accuracy of scribing ±0.1mm
Line width 40μm
Work table
area/trip
Maximum working area: 245×245 mm (2pcs)
Module max running area :300×300 mm
Material size 156 x156~210 x210mm monocrystalline silicon,
polycrystalline silicon solar cells and silicon wafers
Material thickness 0.18-0.30 mm
Cell thickness deviation ±10μm
Breakage rate ≤0.15% 

Equipment configuration
 
Laser Source Raycus 30 W Q-switched λ=1064 nm
Computer  Has storage function, reserved USB interface, with display, mouse, keyboard
Main Control Power
Protection systems
Each motor load should be equipped with short circuit protection / circuit breaker, the equipment is equipped with grounding terminal, in accordance with the national equipment electrical safety regulations.
Vacuum adsorption Bernoulli suction cup (No trace absorption, no damage to the material)
Worktable module Driver Servo Motor  
Ball-screw Module Chinese brand (effective travel range 300 mm)  
Coupling Chinese Brand  
Vacuum adsorption Fan adsorption, automatic control of vacuum generation/breakdown  
Dust removal system Dust removal fan  
Professional software Friendly working interface, simple and convenient programming, motion track display
Power supply 220V/50HZ/3kVA
Safety measures Work area machinery, laser and other dangerous parts, affixed warning signs
Noise Noise generated during normal working conditions complies with national norms
Other Alarm warning

Pictures
The Newest Solar Cell Laser Cutting Machine-Solar Panl Production Line
The Newest Solar Cell Laser Cutting Machine-Solar Panl Production Line
The Newest Solar Cell Laser Cutting Machine-Solar Panl Production Line




 

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