Revolutionize Your Solar Panel Cutting Machine Manufacturing Equipment

• Customization: Available
• Production Scope: Product Line
• Automation: Automation
• Model NO.: OLS-20-F
• After-sales Service: on-Line Support
• Laser Wavelength: 1064nm
• Laser Power: 20W
• Scribing Width: 30μm
• Scribing Speed: 300mm/S
• Warranty: One Year Warranty
• Transmission Type: Flexible
• Automatic Production Line: Assembly
• Certification: CE
• Flexible Production: Intelligent Manufacturing
• Rhythm: Flow Production Line
• Transport Package: Air or Sea Transportation
• Trademark: Ooitech
• Origin: China
• HS Code: 20
• Production Capacity: 50/Per Year
• Package Size: 800.00cm * 600.00cm * 1750.00cm
• Package Gross Weight: 160.000kg

Product Description

[ Machine Function ]
scribing or cutting the Solar Cells and Silicon Wafers in solar PV industry, including the mono-si (mono crystalline silicon) and poly-si (poly crystalline silicon)solar cells and silicon wafer. 

[ Machine Features ]
1. Using the China Top Brand Raycus Fiber laser 
  service time over 100,000hours. Stronger adaptability to environment
2. Work table: X-Y movable
  Solar cell can be automatic absorption 
3. Air cooling, compact structure, small size
4. Higher conversion efficency,
lower operating cost, save power consumption, cost and shorter maintenance time; 
5. Laser Pulse width is more narrow,
Higher peak power, faster scribing cutting speed
6.Long time uninterrupted continuous maintenance-free operation,
 no consumable wearing parts to replace
7. Stepper motor or servo motor different cost.

[ Technical Parameters ]
Model	OLS-20F
Laser wavelength	1064nm
Laser power	20W
Scribing width	30μm
Scribing speed	300mm/s
Scribing accuracy	±10μm
Working area	245x245mm
Temperature control precision	0.5°C
Working power	220V/50Hz/1kvA
Working table	negative pressure absorbing and dust elimination
Cooling method	Forced air cooling